EP1282 Black

  • Description for EP1282 Black

    A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.

    *See Terms of Use Below

    Application Type Bond, Encapsulate, Medium sized casting, Potting
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 65, 100
    Viscosity (cPs) 3,000, Good wetting
    Cure Time (min) 1,440 to 2,880, 60, 20
    Color Black, Clear
    Chemical Resistance Inorganic acids & bases, Organic solvents, Salt spray, Water
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -50, -40
    Key Specifications Recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for UL Standard 94. It qualifies for a horizontal burn rating at 1.5 mm thickness and has an assigned a Performance Level Category (PLC) rating of 0 for Comparative Tracking Index (CTI), this corresponds to >600 volts.
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Temperature Test Method
3,000 cPs 25°C Room Temperature Rheometer parallel plate 25mm@1/s, R050-49
Good wetting
Work / Pot Time Test Methods
Work / Pot Time Temperature Test Method
60 min 25°C Room Temperature Rheometer parallel plate 25mm@1/s R050-49
Tensile Strength Test Methods
Tensile Strength Test Method Test Temperature
1,600 psi R050-36/ASTM D638 25°C Room Temperature
Shear Strength Test Methods
Shear Strength Test Temperature Test Method Type Substrate
1,700 psi 25°C R050-37/ASTM D1002 Lap Shear Strength 0.010” bond line Al to Al
1,450 psi 25°C Room Temperature R050-37/ASTM D1002 Lap Shear Strength 0.010” bond line Al to Al
Compressive Strength Test Methods
Compressive Strength Test Method Test Temperature
25,000 psi R050-38/ASTM D695 25°C Room Temperature
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
3.50 25°C Room Temperature Dielectric constant, 100 Hz, Values considered typical to associated resin systems or extrapolated from other test results.
3.50 23°C 60Hz, values considered typical to associated resin systems or extrapolated from other test results.
Dielectric Strength Test Methods
Dielectric Strength Test Method Temperature
440 V/mil Values considered typical to associated resin systems or extrapolated from other test results. 25°C Room Temperature
500 V/mil Estimated 25°C Room Temperature
Thermal Conductivity Test Methods
Thermal Conductivity Test Method Temperature
0.11 W/m°K 453560822409 25°C Room Temperature
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
2.5e11 (ohms/cm) 25°C Room Temperature Jandel 4 point probe/455300004460
7.44e11(ohm/cm) 25°C ASTM D257 (extrapolated from EP1282 Clear)
Elongation Test Methods
Elongation Test Method
High Elongation Test Method
120 % Tensile, R050-36/ASTM D638
Shore D Hardness Test Methods
Shore D Hardness Hardness Temperature Shore Hardness Test Method
70 25°C Room Temperature R050-17/ASTM D2240
Modulus Test Methods
Modulus Test Method
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method CTE Temperature (°C)
222 (ppm/°C) Above Tg, TMA, 5 °C/min/ASTM E831 25°C Room Temperature
50 (ppm/°C) Values considered typical to associated resin systems or extrapolated from other test results. 25°C Room Temperature
71 (ppm/°C) Below Tg, TMA, 5 °C/min/ASTM E831 25°C Room Temperature
Glass Transition Temp (TG) Test Methods
Glass Transition Temp (TG) Glass Transition Temperature (TG) Test Method
25°C Room Temperature R050-61 by DSC
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1 25°C Room Temperature TM R050-16