EP11HTFS Gray

  • Description for EP11HTFS Gray

    A two part filled epoxy adhesive, a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Thixotropic paste
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 20 to 25, 20 to 25, 65, 25
    Viscosity (cPs) Thixotropic, 750,000
    Cure Time (min) 120 to 240, 1,440 to 2,880, 120, 1,440 to 4,320
    Color Gray
    Chemical Resistance Inorganic acids & bases, Organic solvents, Salt spray, Water
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Questions? Learn more about Gluespec

Viscosity Test Methods
Viscosity Temperature Test Method
Thixotropic Viscosity Test Method
750,000 cPs 25°C TM R050-12
Work / Pot Time Test Methods
Work / Pot Time Temperature Test Method
30 to 40 min 25°C TM R050-19, Mass 50 grams
Tensile Strength Test Methods
Tensile Strength Substrate Type Test Temperature
8,200 psi Tensile Strength Substrate Tensile Strength Type 25°C
3,200 psi 2024 T3 Aluminum Abraded/MEK Wipe) Tensile Lap shear strength 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
2,300 psi Lap Shear Strength 2024 T3 Al Abraded / MEK Wipe TM R050-37
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.50 25°C Dielectric constant 100 Hz, Values considered typical to associated resin systems or extrapolated from other test results.
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
410 V/mil 25°C Values considered typical to associated resin systems or extrapolated from other test results.
Thermal Conductivity Test Methods
Thermal Conductivity Test Method Temperature
0.30 W/m°K Values considered typical to associated resin systems or extrapolated from other test results. 25°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
8e14 (ohms/cm) 25°C Values considered typical to associated resin systems or extrapolated from other test results.
Elongation Test Methods
Elongation Test Method
1 to 2 % TM R050-36, Tensile elongation at Break
Shore D Hardness Test Methods
Shore D Hardness Hardness Temperature Shore Hardness Test Method
85 25°C TM R050-17
Modulus Test Methods
Modulus Test Method
550,000 psi TM R050-36, Tensile modulus
485,000 psi TM R050-38, Compressive modulus
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method CTE Temperature (°C)
40 (ppm/°C) Values considered typical to associated resin systems or extrapolated from other test results. 25°C
Glass Transition Temp (TG) Test Methods
Glass Transition Temp (TG) Glass Transition Temperature (TG) Test Method
71°C TM R050-25, by DSC
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1 25°C TM R050-16